BGA-Bottom-7

The bottom board of this BGA adapter is designed for use with Flash devices arranged in a matrix of 8x6. It is manufactured in Slovakia and has an order number of 70-0292. The connection to the BGA-Top-X is through 4 rows of sockets that accommodate 4x 25 wire wrap pins, ensuring secure and reliable connections. The bottom of the adapter features 2 rows of 2x 24 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm and a row spacing of 600mil. This bottom board is designed to provide a reliable interface for programming and testing Flash devices in a production or development environment, making it a versatile and dependable tool for electronic engineers and technicians.