BGA-Bottom-61

The bottom board of the BGA adapter is specifically designed for SSTLF/VF512/010/020/040 devices in a 9x6 matrix configuration. It is manufactured in Slovakia and is identified by the order number 70-0654.



The bottom board features a connection to the BGA-Top-X board through 4 rows of sockets that are designed for 4x25 wire wrap pins. This enables easy and reliable connectivity between the top and bottom boards for programming and testing of BGA devices.



The bottom board has 2 rows of 2x24 pins, arranged in a square layout with a dimension of 0.6x0.6mm. The rows are spaced 600mil apart, providing compatibility with various BGA devices with different pin configurations.