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bottom board of BGA adapters, assigned for NAND flash devices in 100-ball BGA packages with ONFI 2.x compatible pinout (asynchronous and/or SDR interface support)
made in Slovakia
Ord. no. 70-2331
Connection to BGA-Top-X 4x25 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
| Brand | Elnec |
|---|---|
| GTIN | 1, |
|
Stock |
Shipping Method |
ETA |
Cost |
|
 |
Available |
Self Pickup |
1-2 Day |
Free |
|
Available |
Inside Jordan |
1 - 3 Days |
3 JOD / Free Above 100 JOD |
|
pre-order |
General |
3-5 Weeks |
