BGA-Bottom-169

The bottom board of the BGA adapter with Ord. no. 70-1046 is specifically designed for use with Intel PF38(48)FxxxxM0Y0B devices in a matrix of 12x9 BGA package. The bottom board is manufactured in Slovakia, adhering to high-quality standards.



The connection to the BGA-Top-X is equipped with 8x25 sockets for wire wrap pins, along with 3x20 sockets for additional wire wrap pins, ensuring proper connectivity between the BGA adapter and the Intel PF38(48)FxxxxM0Y0B devices.



The bottom board also features 2x24 square pins with a size of 0.6x0.6mm and a row spacing of 600mil. These pins are designed to provide accurate alignment and electrical connectivity between the BGA adapter and the devices being tested or programmed.