BGA-Bottom-166

The bottom board of BGA adapters with Ord. no. 70-1024 is designed for MCP NAND flash devices with x8/x16 interface in a matrix of 15x10 balls. The bottom board is made in Slovakia and is equipped with a Connection to BGA-Top-X that includes 8x25 3x20 sockets for wire wrap pins, allowing for easy connection to the corresponding BGA-Top board.



The bottom board features a 2x24 pin configuration, arranged in a square shape with dimensions of 0.6x0.6mm, and a rows spacing of 600 mil. This pin configuration is compatible with standard pin configurations for easy connection and compatibility with a variety of devices.



It's important to refer to the manufacturer's documentation or contact the manufacturer directly for specific details on the compatibility of the bottom board with different MCP NAND flash devices, including x8/x16 interface and matrix configurations. This will ensure that you have accurate and up-to-date information for your specific needs.