BGA-Bottom-164

The bottom board of BGA adapters with Ord. no. 70-1007 is specifically assigned for Spansion S72NS-N Based MCPs devices in a matrix of 14x14 to 8x8. It is made in Slovakia and features a connection to BGA-Top-X with 8x25 sockets and 3x20 sockets for wire wrap pins. The bottom of the adapter has 2x24 pins in a square shape with dimensions of 0.6x0.6mm and rows spacing of 600mil. This bottom board is designed to be used in conjunction with the corresponding top board for Spansion S72NS-N Based MCPs devices, allowing for reliable and efficient interfacing with these devices in BGA packages.