BGA-Bottom-148

The bottom board of BGA adapters with Ord. no. 70-1008 is specifically assigned for Samsung K9F5608/16 and MICRON MT29F2G16ABDHC-ET devices in a matrix of 8x6. It is made in Slovakia and features a connection to BGA-Top-X with 4x25 sockets for wire wrap pins. The bottom of the adapter has 2x24 pins in a square shape with dimensions of 0.6x0.6mm and rows spacing of 600mil. This bottom board is designed to be used in conjunction with the corresponding top board for Samsung K9F5608/16 and MICRON MT29F2G16ABDHC-ET devices, allowing for reliable and efficient interfacing with these devices in BGA packages.