BGA-Bottom-108

The bottom board of this BGA adapter is designed specifically for ST STM32F101xx and STM32F103xx devices in a matrix of 10x10 pins. It is manufactured in Slovakia to ensure high quality and reliability. The order number for this bottom board of BGA adapter is 70-0867.



The connection to the BGA-Top-X is made through 8x25 sockets, as well as 3x20 sockets for wire wrap pins, providing a reliable connection between the top and bottom boards during programming and testing operations.



The bottom board features a 2x24 pin configuration, arranged in a square pattern with a pitch of 0.6x0.6mm, and rows spacing of 600mil. This configuration allows for a secure and reliable connection to the STM32F101xx and STM32F103xx devices in the BGA package.



Overall, this bottom board of the BGA adapter is designed to provide a reliable and efficient solution for programming and testing ST STM32F101xx and STM32F103xx devices in a matrix of 10x10 pins, and it is manufactured to high quality standards in Slovakia.