BGA-Bottom-10

The bottom board of the BGA adapter, identified by Ord. no. 70-0337, is specifically designed for Flash devices in a 10x8 matrix configuration. The bottom board is made in Slovakia using high-quality materials and manufacturing processes to ensure its reliability and durability for mass-production applications.



The connection to the BGA-Top-X board is established through 4 rows of sockets for 4x 25 wire wrap pins, providing a reliable and secure connection between the top and bottom boards. This allows for efficient programming and testing of BGA packages.



The bottom board features 2 rows of 2x24 pins in a square pattern, with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration is compatible with Flash devices in a 10x8 matrix arrangement, allowing for easy and precise connections for programming and testing operations.



The BGA adapter bottom board, with Ord. no. 70-0337, is a reliable and durable solution for programming and testing Flash devices in a 10x8 matrix configuration, and is suitable for mass-production purposes.