Solder paste (SD - 528T)

SKU
TPSA0358
Brand
Out Of Stock
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This low melting temperature solder paste is a great low cost, easy to use alternative to removal alloy. A mixture of Sn42 and Bi58, it melts at 138°C and makes it extremely easy to remove large or fragile components like charge ports and FPC connectors without much heat. The solder paste form is very easy to apply and mix with leaded and lead free solder joints already on the board, especially compared to wire removal alloy

More Information
Brand Besomi
GTIN 1,
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Stock

Shipping Method

ETA

Cost

Available

Self Pickup

1 Day

Free

Available

inside UAE

2 - 3 Days

22 AED / Free Above 50 AED

Available

International

4 - 7 Days

180 AED / 49 $

pre-order

General

2 Weeks