ATS-52250P-C1-R0 ,High-Performance BGA Heat Sink (25mm x 25mm x 17.5mm) with Thermal Tape

The ATS-52250P-C1-R0 is a high-performance maxiFLOW™ BGA heat sink designed to enhance thermal dissipation in compact electronics. It features a spread fin array for improved convection cooling, ensuring efficient heat transfer and minimal thermal resistance. The extruded aluminum construction provides lightweight durability, while the pre-applied thermal tape (T412) simplifies mounting. Suitable for high-power BGA components, this heat sink offers optimized cooling performance in forced air environments.

Key Features:

• Optimized maxiFLOW™ Design – Spread fin array increases surface area for enhanced air cooling.
• High Thermal Conductivity – Extruded aluminum minimizes thermal resistance and maximizes heat dissipation.
• Compact & Lightweight – Small 25mm x 25mm footprint, ideal for space-constrained applications.
• Pre-Applied Thermal Tape (T412) – Easy, secure installation with strong adhesion and thermal transfer properties.
• Superior Thermal Performance – Thermal resistance as low as 2.0°C/W at 800 LFM airflow.
• RoHS-6 & REACH Compliant – Environmentally friendly and fully compliant with industry standards.

Additional Specifications:

• Type: BGA Heat Sink
• Attachment Method: Adhesive Mounting
• Material: Extruded Aluminum
• Shape: Rectangular
• Fin Height : 17.5mm