BGA-Top-95 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-0605 is designed with a ZIF (Zero Insertion Force) socket that accepts a wide range of BGA (Ball Grid Array) packages with variations in ball diameter, ball height, and body thickness. The ZIF socket is of high quality and has an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during repeated use.



The top board features a ZIF BGA76 socket with a depopulated array of 52 spring probes, arranged in a ClamShell type configuration. The socket is designed to provide secure and reliable connections to BGA packages during programming or testing.



The connection to the BGA-Bottom-X is established through 4 rows of 25 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm. This configuration is compatible with the corresponding pinout of the BGA-Bottom board, allowing for proper alignment and connection between the top and bottom boards of the adapter.



The top board is made in Slovakia, known for its high-quality manufacturing standards, ensuring reliability and performance. The Ord. no. 70-0605 BGA adapter top board is a versatile and reliable solution for programming or testing BGA packages with varying dimensions, providing efficient and effective operation.