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The top board of the BGA adapter is designed to accept a wide range of BGA packages with variations in ball diameter, ball height, and body thickness. The BGA-Top board features a ZIF (Zero Insertion Force) socket with a high mechanical warranty of 500,000 actuations, ensuring long-term reliability and durability.
The BGA-Top board is manufactured in Slovakia and is identified by Ord. no. 70-0323. It features a ZIF BGA80 socket with a depopulated array of 64 spring probes in a ClamShell type configuration, providing secure and efficient connection to BGA packages.
The connection to the BGA-Bottom-X is achieved through 4 rows of 4x25 pins, arranged in a square pattern with a pitch of 0.6x0.6mm. This versatile design allows for easy adaptation to various BGA packages, making it a reliable solution for BGA programming and testing operations.
| Estimated Delivery | Lead Time 2-3 Weeks |
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Stock |
Shipping Method |
ETA |
Cost |
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Available |
Self Pickup |
1 Day |
Free |
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Available |
Urban Areas in UAE |
1 - 2 Days |
AED 15 / Free Above AED 100 |
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Available |
Remote Areas in UAE |
2 - 3 Days |
AED 15 / Free Above AED 100 |
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Available |
International |
4 - 7 Days |
AED 180 / $ 49 |
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Pre-Order |
General |
4-5 Weeks |
JORD
