BGA-Top-212 ZIF-CS

The top board of the BGA adapter with Ord. no. 70-1100 is designed to work with various BGA packages that differ in ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on this top board is specifically designed to accept BGA76 packages, which are depopulated arrays of 52 spring probes.



The operating (mechanical) warranty of the ZIF socket is 500,000 actuations, indicating a high level of durability and reliability for repeated use. This makes it suitable for high-volume production environments or frequent testing needs.



The ZIF socket type is ClamShell, which allows for easy insertion and removal of BGA packages during programming or testing processes. The top board of the adapter has a connection to the BGA-Bottom board with 4x25 square pins, with a size of 0.6x0.6mm. This configuration is designed to provide accurate alignment and electrical connectivity with the corresponding pins on the BGA-Bottom board.



The BGA-Top board is made in Slovakia and is designed to provide reliable performance in programming or testing of BGA76 packages with depopulated arrays of 52 spring probes.