BGA-Top-196 ZIF-CS

The top board of BGA adapters with Ord. no. 70-1023 is designed to work with a wide range of BGA (Ball Grid Array) packages, including variations in ball diameter, ball height, and body thickness. The ZIF (Zero Insertion Force) socket on this top board features a mechanical warranty of 500,000 actuations, ensuring reliable and durable performance over extended usage.



The ZIF socket on this BGA-Top board is designed to accept a depopulated array of 96 spring probes, allowing for secure and precise connection to BGA packages. The ClamShell type design of the ZIF socket provides easy insertion and removal of the BGA package, facilitating efficient programming and testing operations.



The top board features a connection to BGA-Bottom-X with 4x25 pins arranged in a square shape with dimensions of 0.6x0.6mm, making it compatible with standard pin configurations. The board is made in Slovakia, and it comes with Ord. no. 70-1023. The Accepted package(s) section of the board includes a picture that shows the range of dimensions for BGA packages that are compatible with this BGA-Top board, including ball diameter, ball height, and body thickness. This makes it a versatile and reliable solution for programming and testing BGA packages in various configurations.