BGA-Bottom-90

The bottom board of the BGA adapter is specifically designed for Intel GE(PH)28F256L18(L30) devices in a matrix of 9(13)x7 configuration. It is manufactured in Slovakia and has an order number of 70-0798. The bottom board is used in conjunction with the BGA-Top-X, and features 4x25 sockets for wire wrap pins, providing a reliable connection between the top and bottom boards.



The bottom board of the adapter has 2 rows of 2x24 pins each, arranged in a square pattern with a pin pitch of 0.6x0.6mm and a row spacing of 600mil. This configuration allows for easy and secure connection to Intel GE(PH)28F256L18(L30) devices in the specified matrix configuration. The bottom board is designed to provide a reliable interface for programming, testing, and other operations involving these devices.



With its durable construction and reliable connection design, the bottom board of the BGA adapter is a valuable tool for electronic engineers and technicians working with Intel GE(PH)28F256L18(L30) devices in the specified matrix configuration. It enables efficient and reliable programming, testing, and other operations, making it an essential component in the workflow of working with these devices.