BGA-Bottom-64

The bottom board of the BGA adapter is specifically designed for the STM STR751FR0H6 microcontroller in a BGA (Ball Grid Array) package with an 8x8 matrix. The bottom board is manufactured in Slovakia and is identified by the order number 70-0651.



The connection to the BGA-Top-X board is facilitated through 4 rows of sockets, accommodating 4x 25 wire wrap pins. This allows for efficient interfacing with the BGA package of the STM STR751FR0H6 microcontroller.



The bottom board itself features 2 rows of 2x 24 pins arranged in a square layout with a dimension of 0.6x0.6mm. The rows are spaced at 600 mil, providing appropriate spacing for efficient connectivity. This configuration is specifically designed to interface with the STM STR751FR0H6 microcontroller in the BGA package.