BGA-Bottom-60

The bottom board of the BGA (Ball Grid Array) adapters designed for Samsung K5E5658 memory module is specifically engineered to accommodate the matrix configuration of 13x8. It is manufactured in Slovakia and bears the order number 70-0641.



The connection to the BGA top is established through 8 3 rows, equipped with sockets for 8x25 3x20 wire wrap pins, ensuring reliable connectivity between the top and bottom boards.



The bottom board is comprised of 2 rows, each consisting of 24 pins in a square layout, with a dimension of 0.6x0.6mm. The rows are spaced at 600 mil, providing appropriate spacing for effective interfacing with the BGA top board.