BGA-Bottom-111

The bottom board of the BGA adapter is specifically designed for Sandisk MD2534-d2G-X-P and HY23DF2GAM devices in a matrix of 12x18 configuration. It provides a reliable connection for programming and testing operations. The bottom board is manufactured in Slovakia, known for its high-quality manufacturing standards, ensuring durability and reliability. The order number for this bottom board of the BGA adapter is 70-0871.



The connection to the BGA-Top-X is facilitated through 8x25 3x20 sockets for wire wrap pins, providing a secure and efficient means of connecting to the top board of the BGA adapter. The bottom of the adapter features a 2x24 pin configuration, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration ensures a reliable and secure connection to the Sandisk MD2534-d2G-X-P and HY23DF2GAM devices in the matrix of 12x18 configuration.



Overall, this bottom board of the BGA adapter is designed to provide a reliable and efficient solution for programming and testing Sandisk MD2534-d2G-X-P and HY23DF2GAM devices in a matrix of 12x18 configuration, and it is manufactured to high quality standards in Slovakia.