BGA-Bottom-1

The bottom board of the BGA adapter is designed for use with Flash devices arranged in a matrix of 8x6 balls. It is made in Slovakia and identified by Ord. no. 70-0245.



The connection to the BGA-Top-X (top board) is achieved through 4 rows of sockets, each accommodating 4x25 wire wrap pins, allowing for a reliable and secure connection to the BGA-Top board during testing and programming.



The bottom board features 2 rows of 2x24 pins arranged in a square pattern, with a pitch of 0.6x0.6mm (600 mil) row spacing. This configuration allows for easy and precise connection to the Flash devices in the 8x6 matrix.



The bottom board of the BGA adapter, with 4 rows of sockets for 4x25 wire wrap pins, 2 rows of 2x24 pins in a square pattern with a pitch of 0.6x0.6mm (600 mil) row spacing, made in Slovakia, and identified by Ord. no. 70-0245, is a reliable and convenient option for testing and programming Flash devices arranged in a matrix of 8x6 balls.