JORD
XGSP50 Solder Paste Sn63/Pb37 42G
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The XGSP50 is a solder paste that comes in a 42g net weight. It is composed of Sn63/Pb37 alloy and has a microns size range of 20-38um. This product is ideal for repairing phones, CPUs, and chips. The welding spot created by this solder paste is white and full, and it leaves no rosin joint.
Features:
Sn63/Pb37 alloy composition Microns size range of 20-38um 42g net weight Ideal for phone repair, CPU repair, and chip repair Creates a white and full welding spot Leaves no rosin joint| Brand | Besomi |
|---|---|
| GTIN | 1, |
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Stock |
Shipping Method |
ETA |
Cost |
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 |
Available |
Self Pickup |
1-2 Day |
Free |
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Available |
Inside Jordan |
1 - 3 Days |
3 JOD / Free Above 100 JOD |
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pre-order |
General |
3-5 Weeks |