JORD
XGSP40 SOLDER PASTE 40g
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Out Of Stock
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Specifications:
Material: plastic solder paste
Size: approx. 37 * 22 mm
Model: XGSP40
Alloy: Sn63 / Pb37
Micron: 20-38um
Melting point: 183 degrees Celsius
Applications: Mobile phone repair, computer and digital services industries, high precision circuit board SMT soldering, BGA soldering processes, etc.
| Brand | Besomi |
|---|---|
| GTIN | 1, |
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|
Stock |
Shipping Method |
ETA |
Cost |
|
 |
Available |
Self Pickup |
1-2 Day |
Free |
|
Available |
Inside Jordan |
1 - 3 Days |
3 JOD / Free Above 100 JOD |
|
pre-order |
General |
3-5 Weeks |