XGSP33 SOLDER PASTE 20G
Out of Stock
Out Of Stock
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Materials: plastic and solder paste (blue color)
Type: XGSP33
Alloy: Sn63
Micron: 25-45um
Application: mobile phone repair, computer, and digital service industries, high-precision circuit board SMT welding, BGA welding process
Brand | Besomi |
---|---|
GTIN | 1, |
Stock |
Shipping Method |
ETA |
Cost |
|
Available |
Self Pickup |
1-2 Day |
Free |
|
Available |
Inside Jordan |
1 - 3 Days |
3 JOD / Free Above 100 JOD |
|
pre-order |
General |
3-5 Weeks |