BGA-Bottom-95

The bottom board of the BGA adapter is designed to be compatible with various BGA devices such as Samsung K5D1212, Toshiba TY9000A, ST NAND01G-N, and others. It is made in Slovakia, known for its high-quality manufacturing standards, ensuring durability and reliability. The order number for this bottom board of the BGA adapter is 70-0875.



The connection to the BGA-Top-X is facilitated through 8x25 3x20 sockets for wire wrap pins, providing a secure and efficient means of connecting to the top board of the BGA adapter. The bottom of the adapter features a 2x24 pin configuration, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil. This configuration ensures a reliable and secure connection to various BGA devices, including Samsung K5D1212, Toshiba TY9000A, ST NAND01G-N, and others.



Overall, this bottom board of the BGA adapter is designed to provide a reliable and efficient solution for programming and testing a wide range of BGA devices, and it is manufactured to high quality standards in Slovakia.