BGA-Top-21 ZIF-CS

The top board of the BGA adapters is designed with a ZIF (Zero Insertion Force) socket that can accommodate various variations of BGA (Ball Grid Array) packages. These variations may differ in ball diameter, ball height, and body thickness, as shown in the picture in the "Accepted package(s)" section.



The ZIF socket has an operating (mechanical) warranty of 500,000 actuations, indicating its high durability and suitability for frequent and prolonged use in programming and testing operations.



The top board of the BGA adapter features a ClamShell type ZIF socket, which allows for easy insertion and removal of the BGA48 package during programming and testing operations. The connection to the BGA-Bottom-X (bottom part of the BGA adapter) is through 4 rows of 4x25 pins each, arranged in a square pattern with a pitch of 0.6x0.6mm (600 mil).



The top board of the BGA adapter is made in Slovakia and is identified by Ord. no. 70-0287. It is designed to provide a reliable and efficient solution for programming and testing BGA48 packages with different variations in ball diameter, ball height, and body thickness, and comes with a high operating (mechanical) warranty of 500,000 actuations.