BGA-Top-146 ZIF

The top board of BGA adapters with Ord. no. 70-1012 features a ZIF (Zero Insertion Force) socket of OpenTop type that is designed to accept various variations of BGA (Ball Grid Array) packages. The accepted packages may differ in ball diameter, ball height, and body thickness. The range of all dimensions of BGA packages that are accepted by this BGA-Top board is shown in the picture at the Accepted package(s) section.



The ZIF socket has an operating (mechanical) warranty of 10,000 actuations, ensuring durability and reliability for repeated use. This top board of BGA adapters is made in Slovakia and is assigned for BGA115 packages. The connection to BGA-Bottom-X is through 8x25 3x20 pins in a square shape with dimensions of 0.6x0.6mm. It provides a reliable and convenient solution for interfacing with BGA115 devices in various applications.