BGA-Top-106 ZIF-CS

The top board of the BGA (Ball Grid Array) adapters is designed with a ZIF (Zero Insertion Force) socket that is capable of accepting various variations of BGA packages, which may differ in ball diameter, ball height, and body thickness. The Accepted package(s) section of the board features a range of dimensions that are compatible with this BGA-Top board.



The ZIF socket used in the top board is a ClamShell type, providing a convenient and secure mechanism for inserting and removing BGA packages. It is capable of withstanding repeated actuations, with an operating (mechanical) warranty of 500,000 actuations, ensuring durability and reliability during use.



The top board is manufactured in Slovakia and is identified by the order number 70-0642. It is designed with 8 3 rows, featuring 8x25 3x20 pins in a square layout with a dimension of 0.6x0.6mm, allowing for seamless connection to the BGA-Bottom-X, facilitating effective interconnectivity between the top and bottom boards of the BGA adapter.