BGA-Bottom-94

The bottom board of the BGA adapter is designed for S71WS256PC0HF3TL flash memory devices in a matrix configuration of 10x8 balls. It features sockets for 4x25 wire wrap pins for connection to the BGA-Top-X, allowing for easy and secure attachment. The bottom configuration consists of 2 rows with 2x24 pins in a square pattern, with a pin pitch of 0.6x0.6mm and row spacing of 600mil, ensuring precise and reliable connections. The BGA adapter is made in Slovakia and comes with an order number of 70-0812, guaranteeing quality and performance.