BGA-Bottom-75

The bottom board of the BGA adapter with order number 70-0699 is specifically designed for the Spansion S98WS256NE0FW001 device in a matrix of 17x12 configuration. This bottom board provides a reliable solution for connecting and testing the Spansion S98WS256NE0FW001 BGA device during programming and testing processes.



The bottom board features 2 rows of 2x24 pins in a square configuration, with a pin pitch of 0.6x0.6mm and row spacing of 600mil. This configuration is specifically designed for compatibility with the Spansion S98WS256NE0FW001 device, ensuring a precise and secure connection for programming and testing purposes.



The connection to the BGA-Top-X on this bottom board is designed with 8 3 rows of sockets, providing sockets for 8x25 3x20 wire wrap pins. This configuration allows for a reliable connection between the Spansion S98WS256NE0FW001 device and the BGA-Top-X, enabling efficient programming and testing of the device.



The bottom board of the BGA adapter is made in Slovakia to high manufacturing standards, ensuring quality and reliability. The order number for this bottom board is 70-0699, and it is specifically designed for use with the Spansion S98WS256NE0FW001 device in a matrix of 17x12 configuration.