BGA-Bottom-37

The bottom board of the BGA adapter with Ord. no. 70-0465 is specifically designed for programming and testing Intel GE28F128L18/30, 320W18/30, 640K18/3, 640W18/30 and ST M58LR128F/G, WR032E/F, 064E/F, 128F microcontrollers in BGA packages with a matrix of 8x7. The bottom board is made in Slovakia and adheres to high-quality standards for reliable performance and durability.



The bottom board features 2 rows of 2x24 pins, arranged in a square pattern with a spacing of 0.6x0.6mm and rows spacing of 600mil. These pins provide a secure and reliable connection between the BGA adapter and the microcontroller, facilitating efficient communication and operation during programming or testing.



The connection to the BGA-Top-X board is through 4 rows of sockets for 4x 25 wire wrap pins, ensuring a reliable and efficient connection between the top and bottom boards of the BGA adapter.



The Ord. no. 70-0465 serves as a unique identifier for this specific bottom board, making it easy to identify and track in a professional environment. It is important to follow the manufacturer's guidelines for proper usage of the BGA adapter and the microcontroller to ensure correct functionality and avoid potential damage to the microcontroller or the adapter.