BGA-Bottom-13

The bottom board of the BGA adapter with Ord. no. 70-0366 is specifically designed for Flash devices in a matrix configuration of 13x8. This BGA adapter is made in Slovakia and is intended for professional use in programming and testing Flash devices.



The BGA adapter features a connection to BGA-Top-X with 4 rows of sockets for 4x 25 wire wrap pins, allowing for reliable and precise connections between the adapter and the BGA devices. The bottom board of the adapter has 2 rows of 2x 24 pins each, arranged in a square pattern with a pitch of 0.6x0.6mm and rows spacing of 600mil, ensuring accurate and reliable connections during programming and testing operations.



This BGA adapter is made using high-quality materials and manufacturing processes in Slovakia, ensuring its durability and performance in professional settings. It is specifically designed for Flash devices in a matrix configuration of 13x8, making it a reliable and efficient solution for programming and testing these devices. The Ord. no. 70-0366 serves as a unique identifier for this particular BGA adapter, allowing for easy identification and tracking in a professional environment.